History:1989 - 2004
Promoting a slogan of “no growth without innovation”
1989 | Dainippon Screen (France) S.A. and Dainippon Screen (Canada) Inc. are established. |
---|---|
Akira Ishida is named the company's third president. | |
1990 | Dainippon Screen (Taiwan) Co., Ltd., is established. |
The Open-ended Modular Electronic Graphics Arts (OMEGA) Network is unveiled at DRUPA'90. | |
The company encourages development of LCD production technology. | |
1991 | Bancolini S.r.l. of Italy becomes a subsidiary. |
The company's European headquarters is established. | |
1992 | Operations begin at the Yasu Plant, a large-scale facility for manufacturing semiconductor and LCD production equipment. |
![]() |
|
![]() |
|
1993 |
![]() |
The Valcus photogravure engraving system, which integrates a process from design to engraving of gravure printing, is launched. | |
1994 | New Dallas Office strengthens electronic equipment operations in the U.S.A. |
1995 |
![]() |
![]() |
|
1996 |
![]() |
![]() |
|
1997 | SCREEN, Kyoto Head Office, received the first certification of International Standards ISO14001. |
SCREEN, Hikone Plant, received the first certificate of International Standards ISO9001. All other plants have been working to also acquire this certification. | |
![]() |
|
![]() Its compact design and new chemical-recycling features quickly attracted market interest. |
|
1998 | All plants had received International Standards ISO9000 series certification. |
![]() |
|
![]() |
|
A new manufacturing site "Taga Plant" opened. This facility dramatically increases semicoductor equipment "Spinner" production capacity and anticipates the demands of the gigabit generation. | |
![]() |
|
1999 | Scientific and Semiconductor Manufacturing Equipment Recycling Co., LTD. is established by SCREEN, Towa Corporation and Horiba, Ltd. The company carries out refurbishment of used electronic equipments. |
Support sites for semiconductor equipment are established in Singapore and south Taiwan. | |
SCREEN, Fuji Film and NTT communication has announced start of experimental service of communication application of high speed network for printing, publishing and advertising industries. | |
![]() |
|
![]() |
|
2000 | SCREEN mapped out "Eco value 21", the 5 year scheme for environment management, to reinforce the environment protect, product safety and occupational safety and health. |
Heidelberg, the world leader in printing solution, and SCREEN agree on exchange of CTP technologies. | |
![]() |
|
SCREEN brought in web-based material procurement system. | |
![]() |
|
2001 |
![]() |
SCREEN was transferred the print-circuit detection equipment business from Kobe Steel., Ltd. | |
![]() |
|
SCREEN received "OHSAS18001" certification as occupational safety and health system. | |
Kobe Steel, Ltd. and SCREEN will develop next-generation semiconductor fabrication equipment using supercritical fluid technology. | |
SCREEN joined IMEC's Ultra Clean Processing (UCP) program. SCREEN joined international alliance to develop advanced packaging and interconnect solutions. | |
2002 | Introduced an internal company system. |
![]() |
|
Spun off the domestic sales department of Media Technology Company into a separate operation to establish Media Technology Japan Co., Ltd. | |
Released the "PI-8000", the all-in-one type of optical inspection system for PCB that includes CAM download, inspection, and verification capabilities. | |
Established a joint venture company with Tokyo Electron limited and Ebara Corporation to develop low energy electron beam direct writing system. | |
![]() |
|
Established the company performing a sale and a maintenance service of semiconductor production equipment and FPD production equipment in Shanghai, China. | |
2003 | 100th "working invention competition" takes place. |
PlateRite 8800 thermal CTP unit released. | |
Collaborative project designed to advance next-generation DTP for Mac OS X launched with Apple, Adobe, and Morisawa. | |
PlateRite Ultima thermal CTP unit released. | |
Joint research and development of next-generation photolithography process with Nikon. | |
![]() |
|
Reorganization of semiconductor manufacturing equipment and FPD device manufacturing equipment service operations; SEBACS Co., Ltd. and FEBACS Co., Ltd. established. | |
![]() |
|
Number of maintenance and service locations for flat panel display manufacturing equipment increased in Korea and Taiwan. | |
2004 |
![]() |
![]() |
|
![]() |
|
![]() |
|
![]() |
|
![]() |
|
Launched the Micro Chemical Initiative, which includes six different manufacturers. | |
Cooperated in efforts to preserve cultural treasures electronically. Provided a large format vertical scanner to support the digital archiving project run by the Kyoto Prefecture office of the Association of Shinto Shrines. | |
![]() |
|
Achieved world record, high-speed processing of 150 wafers per hour using a SCREEN RF3 coater/developer linked inline to an ASML exposure system. | |
![]() |
|
Successfully created a micro-reactor unit that enables a direct connection between fine chemical development and industrial production. |