1974 |
The company's first European subsidiary, Dainippon Screen (U.K.) Ltd., is established. |
1975 |
Sales begin for the EMW-322/411 wafer etching machine. |
Tape carrier system that fully automates the IC and LSI chip mounting process is released. |
1977 |
Together with Elna Ltd., the company develops the world's largest fully automatic PCB production line. |
1978 |
First overseas convertible bond (SFr20 million) is issued. This capital is used for expansion overseas and for upgrading domestic operations. |
Dainippon Screen (Deutschland) GmbH is established as a sales and service base in continental Europe. |
The SCW-421 photoresist coating spinner for semiconductor production is developed. |
1979 |
Dainippon Screen Singapore Pte. Ltd. is established. |
1980 |
Together with Toppan Printing Co., Ltd., the company develops a system that directly inputs video image signals (stored on video tape) to a scanner and then outputs as four-color film. |
1981 |
The company develops the Sigma Graph System 2000, the first image processing system produced in Japan. This system is the forerunner of Dainippon Screen's subsequent page makeup systems. |
Dainippon Screen (Nederland) B.V. is established. |
1983 |
Dainippon Screen (Hong Kong) Ltd. is established. |
1984 |
Dainippon Screen Engineering of America Inc. is established to service graphic arts equipment. |
The Beijing Representative Office is opened. |
1985 |
Dainippon Screen Engineering of Europe Co., Ltd., is established to service graphic arts equipment. |
The Shanghai Representative Office is opened. |
The Rakusai Plant, a state-of-the-art facility for manufacturing semiconductor production equipment, is constructed. |
1987 |
Dainippon Screen (Australia) Pty. Ltd. is established. |
1988 |
A majority equity interest is acquired in Island Graphics Corp., a U.S. software company. |
Dainippon Screen's global network spans four continents and numbers more than 20 offices. |