Semiconductor package-related equipment
Semiconductors are continuing to evolve for various applications, including AI.
Packaging technologies, used to protect and integrate these semiconductors into electronic devices, are likewise undergoing major changes in their applications as the industry strives to achieve better system performance, lower manufacturing costs, greater scalability and higher integration density. To meet these needs, we are working to deliver the new technologies and equipment required to produce chiplets such as 2.XD and 3D packages.
