Coater system for Panel Level Package LEMOTIA
LEMOTIA is a Coater/Dryer system specifically designed for advanced semiconductor packaging of FOPLP, glass core substrates and related panels, which are in high demand for 5G/post-5G, IoT infrastructure and data center applications.
SCREEN has applied the technology and know-how of the SK series coater/developer. which has the world's top share for display manufacturing, to this system.
Features
- Designed specifically for advanced semiconductor packages
LEMOTIA is specially designed for advanced semiconductor packages, resulting in a 30% space saving and 10% power capacity reduction compared to our conventional products.
- Equipped with slit coater,LinearcoaterTM which is ideal for high-resolution processes.
- Suitable for coating a wide range of chemicals from low to high viscosity
LEMOTIA is equipped with two types of slit nozzle maintenance systems depending on the viscosity of the chemical solution.
- Integrated system from coating to drying
Streamlined inter-unit logistics for maximum productivity
- Applicable to coating warped panels
All process units are equipped with warp correction jigs to achieve highly uniform coating.
Main applications
Glass core substrate, 2.1D, 2.3D, 2.xD, FOPLP(Fan-Out Panel Level Package), Organic interposer, RDL(Rewiring Layer), PID(isolation layer), Plating resist
Specifications
| Model name |
LEMOTIA LM-6000
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| Coating method |
Slit coater(Die coater)
LinearcoaterTM |
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| Drying method |
Vacuum dryer / Bake
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| Control system |
GEM300 (SEMI standards compliant)
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| Coating chemical |
Chemical solutions for FOPLP
Plating resist(PR), Photosensitive insulating film PID (PI, PBO, Phenolic), TBDB (Temporary adhesive) |
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| Panel |
Glass, mold, and various package glass substrates
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| Panel size |
600 (W) x 600 (L) mm or 510 (W) x 515 (L) mm
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* Linearcoater is a registered trademark and/or a trademark of SCREEN Holdings Co., Ltd.