Contributing to the device industry through high productivity, a small footprint, improved ease of maintenance and operability plus eco-friendly processing to support GX.

These systems inherit a wealth of advanced coat/develop track technologies refined by SCREEN SPE over many years and deliver both outstanding productivity and a smaller footprint. They are also distinctly more environmentally friendly, dramatically reducing resist consumption during wafer coating and electricity consumption throughout the manufacturing process.

FEATURES

RF-200EX

1. Expandability and flexibility to handle both legacy processes and DUV processes

Dedicated design for 200mm wafers enables a small footprint and DUV process. It is compatible with both the replacement of existing equipment and installation in new plants.

2. 300 mm unit technology is redeployed in a new 150–200 mm dedicated platform system

This platform is newly designed exclusively for 200mm, inheriting the multilevel configuration technology cultivated in the existing system for 300mm. In addition, it delivers a small footprint and high productivity using unit processing technologies for cutting-edge devices, such as reducing chemical consumption, particles, defects, and downtime due to improved maintainability.

RF-300EX

1. For thin wafers

Wafer transfer and holding mechanisms specialized for thin wafers provide the coat/develop process without damaging thin wafers.

2. Handles a broad range of chemical solutions for resist, polyimide, SOC and other applications

The RF-300EX provides flexible handling of chemicals by selecting a dispensing system based on the type and viscosity of the chemical. As with the RF-200EX, this system delivers improved processing performance using unit processing technologies for cutting-edge devices, such as reducing chemical consumption, particles, and defects.