1. High Throughput
The FC-3100 is capable of achieving a high throughput of 650 wafers per hour, which has been realized by incorporating a high throughput buffer module and a high-speed transfer module.
2. Stable and Highly Reliable
Seven independent modules can be easily configured to best suit your production needs. Each module is of standardized construction. Dual cleaning baths are built into a single compact module for smoother assembly, adjustment, testing and installation.
3. Low Pressure Drying System (HiLPD)
Provided with the HiLPD, a low pressure drying system, the FC-3100 is able to provide high concentration IPA vapor without using carrier N2 gas to greatly suppress watermark generation. In addition, the high concentration IPA vapor rapidly reduces surface tension preventing pattern collapse.
4. Dry-Air Drying Tecnology(DAD)
DAD is a new Dry Air Drying technology that blows dry air with an extremely low dew point over the wafers to instantly eliminate any moisture after cleaning. It maintains that same performance as conventional drying using IPA, but reduces the processing time by about half(*). It also enables running costs to be reduced to up to1/8 (*) of previous costs, and there is no resist dissolution. Of course, because IPA is not used at all, there are absolutely no VOC emissions. This new drying technology is therefore extremely safe and environment friendly.