A single-wafer cleaner combining the outstanding productivity of up to 24 chambers resulting in high processing technology
Achieving high productivity through a maximum chamber capability of 4 stages x 6 towers.
Cutting-edge drying technology regulates the air-liquid interface on the wafer with high accuracy and speed. The temperature and humidity in the chamber are constantly controlled in the optimal state and are effectively preventing the collapse of increasingly finer, fragile patterns with high aspect ratios.
The ultra-cleaning technology "APAC" installed in the SU-3200 has evolved. The processing environment inside the chamber was improved with the new technology ASC (Advanced Stream Control), which controls the airflow inside the chamber with precision and contributes to the consistencies between chambers.

Wet Station
Spin Processor
Spin Scrubber
_Spin Scrubber(Brush and Chemical Cleaning)