Hybrid type cleaning system combining chemical etching/cleaning functions as well as a brush cleaning function
This advanced industry-first* system simultaneously performs chemical and brush cleaning for highly effective removal of particles on the back side of wafers.
Highly controlled etching using nozzle densification processing and a chemical dispense control function produces high-precision, highly uniform etching that suppresses wafer warping.
The proprietary chuck system securely protects the device surface of wafers, preventing etching residue along the wafer edge and chemical wraparound onto the device surface.
With a space-saving 4-level stacked-tower construction and 16 processing chambers, the SB-3300 delivers an industry-leading practical back-side cleaning capacity of up to 700 WPH, including wafer reversal.
* Based on SCREEN in-house research (as of December 2020)
Wet Station
Spin Processor
Spin Scrubber
_Spin Scrubber(Brush and Chemical Cleaning)