Our new SS-3200 for 200 mm utilizes our existing model for 300 mm wafers as a platform. The 300 mm system has rapidly established itself as the de-facto standard for high-throughput spin scrubbers.
We expect this new model to optimize cleaning processes for power devices, currently the driving force in the 200 mm market.

Features

1. High productivity

The system includes eight chambers stacked in two towers of four levels plus a high-speed multi-hand transfer mechanism. This configuration enables throughput of up to 500 wafers per hour, more than three times faster than our conventional SS-80EX system.

2. Double brush arms

The system is now equipped with multiple types of brushes, allowing simultaneous cleaning with front and bevel brushes and other processes.

3. Reduced use of deinoized (DI) water

Uses around 15% less DI water per chamber than our conventional SS-80EX system.

4. Slide-out spin chambers

The spin chambers are designed to slide out easily, greatly simplifying maintenance.

5. Excellent functional expandability

The system can be configured to handle SMIFs and open cassettes plus an optional hot plate can also be installed.

Spin Scrubber

SS-3200 for 200mm