Contributing to the device industry through high productivity, a small footprint, improved ease of maintenance and operability plus eco-friendly processing to support GX.
These systems inherit a wealth of advanced coat/develop track technologies refined by SCREEN SPE over many years and deliver both outstanding productivity and a smaller footprint. They are also distinctly more environmentally friendly, dramatically reducing resist consumption during wafer coating and electricity consumption throughout the manufacturing process.
1. Expandability and flexibility to handle both legacy processes and DUV processes
Dedicated design for 200mm wafers enables a small footprint and DUV process. It is compatible with both the replacement of existing equipment and installation in new plants.
2. 300 mm unit technology is redeployed in a new 150–200 mm dedicated platform system
This platform is newly designed exclusively for 200mm, inheriting the multilevel configuration technology cultivated in the existing system for 300mm. In addition, it delivers a small footprint and high productivity using unit processing technologies for cutting-edge devices, such as reducing chemical consumption, particles, defects, and downtime due to improved maintainability.
1. For thin wafers
Wafer transfer and holding mechanisms specialized for thin wafers provide the coat/develop process without damaging thin wafers.
2. Handles a broad range of chemical solutions for resist, polyimide, SOC and other applications
The RF-300EX provides flexible handling of chemicals by selecting a dispensing system based on the type and viscosity of the chemical. As with the RF-200EX, this system delivers improved processing performance using unit processing technologies for cutting-edge devices, such as reducing chemical consumption, particles, and defects.