The continuing miniaturization and diversification of semiconductor devices increasingly requires wet cleaning systems that can prevent damage to fragile patterns while controlling microscopic particles. At the same time, these systems must also be able to deliver high productivity and stable processing that effectively reduce the cost of ownership.
SCREEN Semiconductor Solutions developed the first rotating wafer cleaning system in 1983. Over the past 30 years, we have made it our mission to optimize processing at the air-liquid interface on the wafer and further refine critical cleaning technologies. Our new SU-3300 seventh generation system inherits every aspect of this accumulated technical expertise and knowhow.
The SU-3300 can be expanded to include up to 24 chambers, giving it outstanding productivity. It also offers high processing efficiency and is equipped with cutting-edge functions that minimize variations between chambers. Together these features ensure extremely stable operation. As semiconductor production becomes increasingly demanding, SCREEN is right there with you, creating remarkable new solutions like the SU-3300.
1. Industry-leading 24 Chamber Configuration
The SU-3300’s incredible productivity is approximately double that of our SU-3200 model, making it one of the highest performing systems in the entire single wafer cleaning field. It is able to deliver throughput similar to a batch-type cleaner while maintaining superb cleaning quality. These features support highly effective production of any semiconductor device.
2. Dramatically Reduced Collapsing of Fragile Patterns
Our new Nanodry7 drying technology enables rapid, high-precision processing that efficiently controls the air-liquid interface on the wafer surface. Nanodry7 maintains the temperature and humidity inside the chambers at consistently optimum levels, effectively reducing damage to the increasingly fragile high aspect ratio patterns on wafers.
3. Major Improvements in Etching Uniformity with Reduced Chemical Usage
Nano control nozzles provide extremely high-precision management of chemical temperatures, flow rates and dispensing points. They reduce chemical usage by approximately 50% compared to conventional systems, delivering major improvements in etching uniformity on the wafer surface.
4. Even Higher Chamber Cleanness with APAC2* Technology
The super-clean APAC technology first installed in the SU-3200 has been further improved for the SU-3300.
New advanced stream control (ASC) technology also manages airflow inside the chambers with great precision, improving the in-chamber environment. These technologies combine to significantly reduce variations between individual chambers.