1. Equipped with the industry's largest of 24 chambers
Achieving high productivity through a maximum chamber capability of 4 stages x 6 towers.
2. Significant elimination of micropattern collapse
Cutting-edge drying technology regulates the air-liquid interface on the wafer with high accuracy and speed. The temperature and humidity in the chamber are constantly controlled in the optimal state and are effectively preventing the collapse of increasingly finer, fragile patterns with high aspect ratios.
3. Superb etch uniformity and chemical reduction achieved
Equipped with "Nanocontrol nozzle" technology providing high precision control of temperature, flow rate, and discharge position of the chemical solution. Dramatically improved uniformity of etching within the wafer surface with about half the amount of chemicals is achieved.
4. APAC2*: taking chamber cleanliness to new standards
The ultra-cleaning technology "APAC" installed in the SU-3200 has evolved. The processing environment inside the chamber was improved with the new technology ASC (Advanced Stream Control), which controls the airflow inside the chamber with precision and contributes to the consistencies between chambers.