Direct imaging system for advanced packages
DW-3100
High-definition, high-productivity direct imaging system
Featuring maskless technology for diverse packaging needs
1. Industry-leading precision of below 1 μm using our proprietary
GLVTM imaging heads and optical system
2. Three types of alignment method: global, local and die-by-die
3. Two dedicated models for 300 mm wafers and
310 mm square panel substrates
Products
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- Wafer Cleaning System
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Wet Station
- Wet Station FC-3100
- Wet Station WS-620C/WS-820C/WS-820L
- Wet Station FC-821L
- Compact Wet Station CW-2000
Spin Processor
- Single Wafer Cleaner SU-3400
- Single Wafer Cleaner SU-3300
- Single Wafer Cleaner SU-3200
- Single Wafer Cleaner SU-2000
- Spin Processor SP-2100
Spin Scrubber
_Spin Scrubber(Brush and Chemical Cleaning)
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- Annealing System
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- Advanced Packaging Lithography