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The high-definition Direct Imaging System is suitable for semiconductor package substrate’s circuit pattern formation and solder resist exposure.

The Direct Imaging System specializes in improving productivity while maintaining high quality.

The Direct Imaging System emphasizes versatility and productivity with a 3-wavelength LED light source.

The versatile AOI System can simultaneously inspect both circuits and laser vias of various construction methods (* excluding X grade).

The AVI System provides you the optimum work environment with highly reliable detection and easy operation.

SCREEN’s unique laser technology and GLV optical engine enable high resolution L/S=5/5um.

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IoT-connected Society

Direct Imaging System Ledia7

The most ideal direct imaging equipment for various semiconductor package substrates by starting with FC-CSP

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Ledia7

Direct Imaging System Ledia7

The most ideal direct imaging equipment for various semiconductor package substrates by starting with FC-CSP

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Direct Imaging System Ledia twin

A new type of Ledia is now available!

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Ledia twin

Direct Imaging System Ledia twin

The most productive direct imaging system in the world

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Direct Imaging System Ledia

Cutting-edge Technology
Creates a Brighter Future

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Ledia

Direct Imaging System Ledia

Cutting-edge Technology
Creates a Brighter Future

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Direct Imaging System Levina

Direct imaging equipment for patterning suitable for advanced package such as FCCSP, FCBGA and FOPLP

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levina

Direct Imaging System levina

Direct imaging equipment for patterning suitable for advanced package such as FCCSP, FCBGA and FOPLP

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Automatic Optical Inspection System MIYABI7

Advanced line-up to meet coming LVH inspection demand

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MIYABI7

Automatic Final Visual Inspection System FP-9200

Creating an optimal AVI environment with easier operation and faster verification

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FP9200