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The high-definition Direct Imaging System is suitable for semiconductor package substrate’s circuit pattern formation and solder resist exposure.
The Direct Imaging System specializes in improving productivity while maintaining high quality.
The Direct Imaging System emphasizes versatility and productivity with a 3-wavelength LED light source.
The versatile AOI System can simultaneously inspect both circuits and laser vias of various construction methods (* excluding X grade).
The AVI System provides you the optimum work environment with highly reliable detection and easy operation.