News

SCREEN Semiconductor Solutions Co., Ltd. (SCREEN SPE) has finalized development of the DW-3100, a cutting-edge direct imaging system for advanced semiconductor packages. Sales of the new system will begin this month.

DW-3100

High-resolution (300dpi) photo
can be downloaded from
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In recent years, the rapid evolution of AI semiconductors has created the need to accommodate larger semiconductor packages and heterogeneous integration, in which different types of chips are combined into a single unit. As a result, there has been a surge in demand for direct imaging systems that offer higher precision and more flexible exposure control.

In response to these market trends, SCREEN SPE has developed the DW-3100, the latest addition to its lineup of direct imaging systems. Like its predecessor, the DW-3000, the DW-3100 employs SCREEN’s proprietary GLV^TM* technology to deliver high-precision, high-throughput maskless exposure. It also achieves an industry-leading resolution of below 1 µm thanks to its fully redesigned optical system.

In addition, the DW-3100 incorporates proprietary correction technologies for image processing that detect wafer warpage, distortion, and chip misalignment, enabling optimal exposure for each wafer and chip. It is also able to utilize its special features as a direct imaging system to pattern unique IDs onto individual chips. This facilitates the management of manufacturing records in areas requiring high reliability, such as the medical device field.

The new system is also compatible with square panels in addition to wafers. Thanks to its comprehensive range of features, the DW-3100 is able to flexibly meet the diverse needs of the expanding semiconductor packaging market.

With the release of the DW-3100, SCREEN SPE intends to further accelerate its expansion into the semiconductor packaging market. SCREEN will continue supporting the sustainable development of the industry by responding to diversifying client needs in a timely and effective manner.

* Grating Light Valve: An optical modulator that is able to control the direction and intensity of light by utilizing the coherence of light. Based on MEMS technology, each one has a structure in which thousands of extremely fine light-reflecting ribbons are arranged in rows above a substrate. This allows it to control multiple channels of light simultaneously.

Contact:
SCREEN Semiconductor Solutions Co., Ltd.
screenspe-info@screen.co.jp

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