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SCREEN Is Selected for NEDO Project to Develop Semiconductor Front-end Process Technologies for Post-5G Communication Systems

April 06, 2021

Doc. No.: SPE210406E

Kyoto, Japan – April 6, 2021 – SCREEN Semiconductor Solutions Co., Ltd. (SCREEN SPE), together with Tokyo Electron Ltd. and Canon Inc., has been selected by the New Energy and Industrial Technology Development Organization (NEDO) to participate in the “Development of Advanced Semiconductor Manufacturing Technology (Grant)” program of its “Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems”. SCREEN SPE are pleased to announce that its application has been accepted in the category for the “Development of front-end process technology (miniaturization technology) for advanced semiconductors”.

This program specifically targets development of the highly scaled front-end process technologies required to manufacture semiconductor devices beyond the 2 nm node. Under the program, SCREEN SPE will focus on research and development related to cleaning and annealing technologies as well as associated equipment.

SCREEN SPE’s role in this key project demonstrates its ongoing commitment to the development of cutting-edge semiconductor production technologies. It is dedicated to continuing its long history of contribution to the industry as a leading manufacturer of advanced cleaning equipment.

 

Contact:
SCREEN Semiconductor Solutions Co., Ltd.
Marketing Department
+81-75-417-2527
speinfo@screen.co.jp

Information contained in the news letter are current on the date of publication, but may be subject to change without notice.