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SCREEN Launches New Spin Processor for Single Wafer Cleaning - System Delivers Exceptional Cost Performance Even for Wide Range of Compound Wafers -

June 25, 2020

Doc. No.: SPE200625E

Kyoto, Japan – June 25, 2020 – SCREEN Semiconductor Solutions Co., Ltd. (SCREEN SPE) has launched its new SP-2100 spin processor for single wafer cleaning. The SP-2100 provides outstanding cost performance and is able to process wafer sizes of up to 200 mm (8"). Sales of the system have already begun.

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SP-2100 spin processor

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In recent years, demand has increased rapidly for 5G smartphones, in-vehicle electronics and other devices and applications that require wafer sizes of 200 mm or less to produce. Growing environmental awareness has also driven demand for power semiconductors, which enable more efficient energy management in applications such as air conditioners, trains and electric vehicles. These developments have in turn led to increasing calls for wafer cleaning systems that are able to flexibly handle a variety of sizes, types and production volumes while also delivering superior cost performance.

In response to these trends, SCREEN SPE has developed the SP-2100 spin processor. The SP-2100 inherits much of the knowhow and many of the cutting-edge technologies developed by SCREEN SPE over its long history in the wafer cleaning field.

As well as standard silicon wafers, the SP-2100 handles a diverse range of compound wafers that have been difficult to process optimally in conventional systems. It is also able to process a wide variety of sizes from 76 mm (3") right up to 200 mm (8").

In addition, the system can be equipped to perform metal etching and features its own built-in chemical cabinet in the main body. This unit would usually need to be installed in a sub-area within the factory and incorporating it into the body achieves major space savings. The number of processing chambers can also be selected based on the purpose and application. This allows the system to be flexibly configured to suit individual production environments.

With the launch of its new SP-2100, SCREEN SPE is aiming to drive growth within the market for semiconductor production equipment targeting wafer sizes of 200 mm and below. This segment is expected to see a rapid expansion in demand as adoption of the Internet of Things accelerates. Going forward, SCREEN SPE plans to continue addressing a wide range of specific needs, even as these needs further diversify. Its overall goal remains to support the long-term growth of the semiconductor industry.

Contact:
SCREEN Semiconductor Solutions Co., Ltd.
+81-75-417-2527
speinfo@screen.co.jp

Information contained in the news letter are current on the date of publication, but may be subject to change without notice.