About touch screen panel equipment
Capacitive Touch Sensor (Film Type) Production Process
When using photosensitive Ag
| Pattern Design / Data Editing |
The design data for the ITO pattern and the metal circuit pattern (bezel area) is created using a CAM system. That pattern data is edited and treated for use according to the process and application. ● Setup Station CU-9000 |
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| ITO Film Processing |
A transparent electrode film such as ITO is sputtered onto the film at the base of the touch sensor. After then annealing, crystallinity and optical transmittance is increased while sheet resistance is lowered. |
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ITO Pattern Formation |
An ITO design pattern for sensing the touched coordinates is formed and photoresist is laminated onto the surface of the ITO film. |
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Direct Exposure Direct Pattern Exposure
● Direct Imaging System Ledia |
With Photomask Photomask Creation
 Photomask Inspection
Pattern Exposure
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The ITO design pattern is exposed directly onto the surface of the ITO film laminated with photoresist according to the CAM data, without using a photomask. The exposure data is corrected in real-time in accord with expansion, contraction and distortion of the film.
The pattern is plotted onto the film or glass to create an exposure photomask.
Photomask expansion and contraction, and the width of the lines in its circuit pattern, are measured and inspected for defects.
The ITO design pattern is exposed through a photomask onto the surface of the ITO film laminated with photoresist.| Developing, Etching & Stripping | After the photoresist is developed, the ITO film is etched with a solution and the unnecessary photoresist is stripped off. |  |
| Metal Circuit Pattern Formation (Bezel Area) |
Metal with a lower resistance (photosensitive silver paste) is used to create the metal circuit pattern as the lead wires from the viewer area to the PCB. Using the screen or other printing method, photosensitive silver paste is applied to the metal circuit pattern (bezel area) and then dried. |
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Direct Exposure Direct Pattern Exposure
● Direct Imaging System Ledia
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With Photomask Photomask Creation The pattern is plotted onto the film or glass to create an exposure photomask. Photomask Inspection Photomask expansion and contraction, and the width of the lines in its circuit pattern, are measured and inspected for defects. Pattern Exposure The metal circuit pattern is exposed through a photomask onto the surface of the ITO film applied with photosensitive silver paste. |
The metal circuit pattern is exposed directly on the surface of the ITO film applied with photosensitive silver paste according to the CAM data, without using a photomask. The exposure data is corrected in real-time in accord with expansion, contraction and distortion of the film.|
Developing & Curing |
The metal circuit pattern is developed and the ITO film is heated to give it adhesive properties. |
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Circuit Pattern Inspection |
The metal circuit pattern is inspected for defects and appearance. |
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Protective Layer Formation / ITO Film Bonding (for GFF) |
A protective layer is formed by applying a protective agent or sputtering SiO2. In the case of a GFF structure, the ITO films that form the X-axis and Y-axis electrodes are stacked together. |
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Connection to PCB |
Connection is made to the printed circuit board and the sensor is complete. |