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SOKUDO Lithography Breakfast Forum 2014

July 09, 2014

21st Annual
SOKUDO Lithography Breakfast Forum 2014

Collaboration for Success

Date: Wednesday, July 9, 2014
07:30 Breakfast, 08:00-10:00 Presentations

San Francisco Marriott Marquis,
Mission & 4th Street, San Francisco, California

Speakers: An Steegen, Senior VP, Process Technology, IMEC
Laurent Pain, Patterning Prog. Mgr., CEA-LETI
Mark Kelling, Director, Lithography, G450C
Steve Renwick, Sr. Research Scientist, NIKON RCA
Hans Meiling, Sr. Director, Prog. Mngt. EUV, ASML



The future of semiconductor IC patterning is at cross-roads between multiple lithography options, complementary and alternative technologies. Immersion ArF multi-patterning, EUV, Multi-E-beam, Directed Self-Assembly (DSA), etc. with 450mm wafer size transition on the horizon. The industry model for semiconductor manufacturing, equipment and materials development costs is by pre-competitive collaboration for success.


Presentation files available for registered attendees only. For inquiries please contact

Hosted by SOKUDO Co., Ltd., coat / develop track products Subsidiary of Dainippon Screen Mfg. Co., Ltd. in cooperation with SEMI