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EVENT

SOKUDO Lithography Breakfast Forum 2014

July 09, 2014

21st Annual
SOKUDO Lithography Breakfast Forum 2014
Collaboration for Success

Date:	Wednesday, July 9, 2014
Time:	07:30 Breakfast, 08:00-10:00 Presentations
Location:	San Francisco Marriott Marquis, Mission & 4th Street, San Francisco, California

Speakers:	An Steegen, Senior VP, Process Technology, IMEC Laurent Pain, Patterning Prog. Mgr., CEA-LETI Mark Kelling, Director, Lithography, G450C Steve Renwick, Sr. Research Scientist, NIKON RCA Hans Meiling, Sr. Director, Prog. Mngt. EUV, ASML

The future of semiconductor IC patterning is at cross-roads between multiple lithography options, complementary and alternative technologies. Immersion ArF multi-patterning, EUV, Multi-E-beam, Directed Self-Assembly (DSA), etc. with 450mm wafer size transition on the horizon. The industry model for semiconductor manufacturing, equipment and materials development costs is by pre-competitive collaboration for success.

Presentation files available for registered attendees only. For inquiries please contact
info@sokudospeed.com

Hosted by SOKUDO Co., Ltd., coat / develop track products Subsidiary of Dainippon Screen Mfg. Co., Ltd. in cooperation with SEMI

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