SCREEN PE Solutions Co., Ltd. (SCREEN PE) has developed a new direct imaging system called “LUPIOS” for mid-range package substrates. The product will be released for sales in October 2025.

LUPIOS

Please download the photo from

www.screen.co.jp/about/nr-photo_2025

With the growing adoption of AI technologies, software and hardware development based on AI is accelerating across electronics-related applications such as data center servers, PCs, automobiles, and smartphones. As a result, demand is increasing for high-end as well as mid-range package substrates, along with rising expectations for stable quality and improved production efficiency.

In response to these industry needs, SCREEN PE has developed “LUPIOS” as a direct imaging system for mid-range package substrates. This system inherits the core technologies of the Ledia series, which holds the top market share in solder resist direct imaging, while achieving high positional accuracy through proprietary calibration functions and high productivity via a newly developed exposure head.

With the launch of “LUPIOS,” SCREEN PE can now offer a comprehensive solution for package substrate applications, alongside the previously released “Ledia 8F” and “Ledia Qs” for high-end package substrates. This contributes to improved operational efficiency of production.

By responding to diverse needs in the ever-growing package substrate market, SCREEN PE will lead the further development of the electronics device industry.

• Photo
• PDF