High-speed, uniform processing even with large substrates

Low-Inductance Antenna (LIA™) ICP plasma technology and our large substrate transfer technology are used in large substrate processing equipment.

LIA™ plasma technology features high-density plasma generation while reducing damage to substrates, while large substrate transfer technology was developed for our FPD manufacturing equipment that holds the largest share of the world market. These technologies are combined to enable high-speed, uniform processing even with large substrates.

LIA™ Plasma CVD

LIA™ Sputter

Dry etcher

* LIA is a registered trademark and/or a trademark of EMD Corporation.