LIA Sputter Equipment VS-R400G/F

SCREEN's proprietary LIATM(Low Inductance Antenna) plasma source enables ultra high speed, high quality vacuum deposition.


  1. Sputtering equipment ideal for experiments, research, evaluation, and trial production.
  2. Using the assistive effect of LIA™-ICP (Inductively Coupled Plasma) enables high speed, high accuracy, and low damage deposition.  In addition, taking advantage of the characteristics of high-density plasma, it can also be used as reactive sputtering.
      About LIATM
  3. By installing a rotary cathode, it is possible to increase the deposition speed.
  4. The results obtained with this machine are easily fed back to the production machine. We support customers' efficient development and mass production deployment to realize a highly productive mass production environment.

Main applications

Functional films, Surface modification, Surface treatment, Ashing, Modification, Nitriding, Oxidation, Passivation


 Model name
 Substrate type
Square substrate
(Glass, Metal, etc.)
Resin film (PET, PEN),
metal foil
 Target for deposition
ITO, ALUMINA, Chemical compaund, and other metal film
 Substrate size*
W400 x L500 mm
500 mm width
 Deposition method
Deposition down, in-line deposition

* Contact us for other substrate sizes.

* LIA is a registered trademark and/or a trademark of EMD Corporation.

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