Manual Sputter Equipment VS-R400G/F
- Sputter equipment for testing, research, evaluation, and trial production.
- Using the assistive effect of LIA™-ICP (Inductively Coupled Plasma) for high speed, high accuracy, low damage deposition
- An LIA™-ICP assist function can be added to reactive sputtering for ultra high-speed deposition (more than 5x faster than SCREEN's conventional units).
- A rotary cathode incorporated for pure metal sputtering enables both high-speed deposition and COO reduction.
- Verification on this Laboratory Equipment can be easily fed back to production units.
R&D to mass production
(Glass, Metal, etc.)
Resin film (PET, PEN),
|Target for deposition||
ITO, ALUMINA, Chemical compaund, and other metal film
W400 x L500 mm
500 mm width
Deposition down, in-line deposition
* Contact us for other substrate sizes.
* LIA is a registered trademark and/or a trademark of EMD Corporation.