Sputter Equipment VS-R400G/F
SCREEN's proprietary LIATM(Low Inductance Antenna) plasma source enables ultra high speed, high quality vacuum deposition.
Features
- Sputtering equipment ideal for experiments, research, evaluation, and trial production.
- Using the assistive effect of LIA™-ICP (Inductively Coupled Plasma) enables high speed, high accuracy, and low damage deposition. In addition, taking advantage of the characteristics of high-density plasma, it can also be used as reactive sputtering.
About LIATM - By installing a rotary cathode, it is possible to increase the deposition speed.
- The results obtained with this machine are easily fed back to the production machine. We support customers' efficient development and mass production deployment to realize a highly productive mass production environment.
Main applications
Functional films, Surface modification, Surface treatment, Ashing, Modification, Nitriding, Oxidation, Passivation
Specifications
| Model name |
VS-R400G
|
VS-R400F
|
| Substrate type |
Square substrate
(Glass, Metal, etc.) |
Resin film (PET, PEN),
metal foil |
| Target for deposition |
ITO, ALUMINA, Chemical compaund, and other metal film
|
|
| Substrate size* |
W400 x L500 mm
|
500 mm width
|
| Deposition method |
Deposition down, in-line deposition
|
|
* Contact us for other substrate sizes.
* LIA is a registered trademark and/or a trademark of EMD Corporation.