Plasma CVD Equipment VC-R400G/F
SCREEN's proprietary LIA™ (Low Inductance Antenna) plasma source enables ultra high speed, high quality deposition.
SCREEN's proprietary LIATM(Low Inductance Antenna) plasma source enables ultra high speed, high quality vacuum deposition.
Features
- CVD equipment ideal for experiments, research, evaluation, and trial production.
- Using the assistive effect of LIA™-ICP (Inductively Coupled Plasma) enables high speed, high accuracy, and low damage deposition.
About LIATM - Multipoint control (either manual or automatic) enables more detailed uniformity. Various other options are available as well.
- Newly developed bias power supply available for use with DLCs.
- Ultra high-speed deposition possible. (more than 5x faster than SCREEN's conventional units)
- The results obtained with this machine are easily fed back to the production machine. We support customers' efficient development and mass production deployment to realize a highly productive mass production environment.
Main applications
DLC, Functional films, Surface modification, Surface treatment, Etching.
Specifications
Model name |
VC-R400G
|
VC-R400F
|
Substrate type |
Square substrate
(Glass, Metal, etc.) |
Resin film (PET, PEN),
metal foil |
Target for deposition |
DLC, SiN, SiO, etc.
|
|
Substrate size* |
W400 x L500 mm
|
500 mm width
|
Deposition method |
Deposition down, static deposition (or in-line deposition)
|
|
Stage temp |
Max. 500℃
|
* Contact us for other substrate sizes.
* LIA is a registered trademark and/or a trademark of EMD Corporation.