SCREEN's proprietary LIA(Low Inductance Antenna) Plasma source enables ultra high speed, high quality deposition.


  1. Dry etching equipment for testing, research, evaluation, and trial production.
  2. Using the assistive effect of LIA™-ICP (Inductively Coupled Plasma) for high speed, high accuracy etching.
  3. Low pressure, high-speed etching equipment with LIA™-ICP.
  4. Multipoint control (either manual or automatic) enables more detailed uniformity. Various other options are available as well.
  5. Deep etching also possible.
  6. Contact SCREEN in regard to a bias power supply for your particular needs. DP mode and RIE mode also available.
  7. Verification on this Laboratory Equipment can be easily fed back to production units.

R&D to mass production

Supports mass-production of various substrate sizes.


 Substrate type
Si, quartz, blue sheet glass, resist (organic layer) ashing
 Substrate size*
W400 x L500 mm
 Etching method
Static etching

* Contact us for other substrate sizes.

* LIA is a registered trademark and/or a trademark of EMD Corporation.

Contact us