Manual Dry Etching Equipment VE-R400G
SCREEN’s proprietary LIA™ (Low Inductance Antenna) plasma source enables ultra high speed, high quality etching.
Features
- Dry etching equipment for testing, research, evaluation, and trial production.
- Using the assistive effect of LIA™-ICP (Inductively Coupled Plasma) for high speed, high accuracy etching.
- Low pressure, high-speed etching equipment with LIA™-ICP.
- Multipoint control (either manual or automatic) enables more detailed uniformity. Various other options are available as well.
- Deep etching also possible.
- Contact SCREEN in regard to a bias power supply for your particular needs. DP mode and RIE mode also available.
- Verification on this Laboratory Equipment can be easily fed back to production units.
R&D to mass production
Supports mass-production of various substrate sizes.
Specifications
| Substrate type |
Si, quartz, blue sheet glass, resist (organic layer) ashing
|
| Substrate size* |
W400 x L500 mm
|
| Etching method |
Static etching
|
* Contact us for other substrate sizes.
* LIA is a registered trademark and/or a trademark of EMD Corporation.