SCREEN Finetech Solutions Co., Ltd. (SCREEN FT) has expanded the lineup of its Lemotia coater/dryer system for advanced semiconductor packaging with a newly developed model capable of processing 300 × 300 mm and 310 × 310 mm panel substrates. With this addition, the Lemotia platform now supports a wider range of substrate sizes, enabling customers to establish stable processes from early development and prototyping through to full-scale production.

In recent years, the spread of 5G/post-5G communications and increasingly high-performance AI-related devices have driven growing interest in new manufacturing technologies for realizing semiconductor packaging with higher wiring densities and lower costs. Alongside these developments, FOPLP¹ and other approaches to semiconductor packaging manufacturing using rectangular panels have been gaining momentum, and technological development targeting 300 × 300 mm-class substrates has been moving forward. As a result, there is growing demand for equipment suited to coating the various panel sizes being used.

To address these evolving needs, SCREEN FT has developed a model of the Lemotia coater/dryer system for 300 × 300 mm and 310 × 310 mm panels, complementing the 600 × 600 mm and 510 × 515 mm model announced in 2023, thus offering a lineup that can accommodate a diverse range of substrate sizes.

The new model leverages SCREEN FT’s global market share-leading coating technologies² cultivated in the display manufacturing field and applies this expertise to coating and drying processes optimized specifically for semiconductor packaging. The new Lemotia model delivers excellent coating uniformity across a wide range of material viscosities and precise film thickness control. In addition, all process units incorporate a system that suppresses substrate warpage, enabling stable film formation. These capabilities support higher yields and improved process stability in advanced package manufacturing.

SCREEN FT will continue to broaden the application of its core coating technologies across both the display and semiconductor packaging fields, contributing to the development of each industry.

1. FOPLP: Fan-out panel level packaging. A semiconductor packaging method for applying the fan-out wafer level packaging (FOWLP) manufacturing process to panels larger than wafers.
2. Based on SCREEN FT’s 2024 internal survey of TFT array coater-developer system market share.

Note: Lemotia is a trademark or registered trademark of SCREEN Holdings Co., Ltd.

APCS (Advanced Packaging and Chiplet Summit) 2025
The new Lemotia model will be introduced by SCREEN Holdings Co., Ltd. at APCS (Advanced Packaging and Chiplet Summit) 2025, held at Tokyo Big Sight from December 17 (Wed.) to 19 (Fri.), 2025.
https://www.semiconjapan.org/en/apcs