Coater system for Panel Level Package Lemotia

Linearcoater™ series

Lemotia is a Coater/Dryer system specifically designed for advanced semiconductor packaging of FOPLP, glass core substrates and related panels, which are in high demand for 5G/post-5G, IoT infrastructure and data center applications.
SCREEN has applied the technology and know-how of the SK series coater/developer. which has the world's top share for display manufacturing, to this system.

Features

Designed specifically for advanced semiconductor packages.
Lemotia is specially designed for advanced semiconductor packages, resulting in a 30% space saving and 10% power capacity reduction compared to our conventional products.
Equipped with slit coater,Linearcoater^TM which is ideal for high-resolution processes.

Suitable for coating a wide range of chemicals from low to high viscosity.
Lemotia is equipped with two types of slit nozzle maintenance systems depending on the viscosity of the chemical solution.
Integrated system from coating to drying.
Streamlined inter-unit logistics for maximum productivity.
Applicable to coating warped panels.
All process units are equipped with warp correction jigs to achieve highly uniform coating.

Main applications

Glass core substrate, 2.1D, 2.3D, 2.xD, FOPLP(Fan-Out Panel Level Package), Organic interposer, RDL(Rewiring Layer), PID(isolation layer), Plating resist.

Specifications

Model name	Lemotia LM-6000
Coating method	Slit coater(Die coater) Linearcoater^TM
Drying method	Vacuum dryer / Bake
Control system	GEM300 (SEMI standards compliant)
Coating chemical	Chemical solutions for FOPLP Plating resist(PR), Photosensitive insulating film PID (PI, PBO, Phenolic), TBDB (Temporary adhesive)
Panel	Glass, mold, and various package glass substrates
Panel size	600 (W) x 600 (L) mm or 510 (W) x 515 (L) mm

* Linearcoater is a registered trademark and/or a trademark of SCREEN Holdings Co., Ltd.