Features

Cleaning Processor TS series

1. The inclined substrate transfer system and multiphase cleaning used in the TS series enabled effective particle removal.
2. The inclined transfer system reduces consumption of DI water and air.

Wet Etcher TE series

1. A combination of original spray nozzles and horizontal/inclined processing enables outstanding etching processes to suit customers' processes.
2. Rinsing and drying chambers employs inclined transfer system, which reduces consumption of DI water and air.

Resist Stripper TR series

1. The TR series equipment's Multi Scan Jet stripping tool and inclined transfer system enable extremely effective stripping. They inhibit the generation of mist, and prevent resist from re-adhering to or remaining on the substrate.
2. The inclined transfer system reduces consumption of DI water and air.
3. Inline cleaning modules are available for cleaning after resist stripping.

Developing Processor TD series

1. Dip, Spray or puddle processing are available.
2. The inclined transfer system reduces consumption of DI water and air.
3. Integrated photolithography line configuration (Coater/Developer) is available. (option)

【Substrate size】
　　300 × 300mm or larger

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