Manual Hot Plate
The hot plate applies heat to the underside of substrate to facilitate uniform drying of coating materials and moisture on the top surface.
Features
- Compact device ideal for an experimental laboratory
- Elimination of unevenness caused by items such as pins thanks to the flat surface of the hot plate
- Optional installation of substrate support pins and lifting mechanism for substrate removal
Specifications
| Substrate size |
Max. W400 x L500 mm
|
| Processing temp |
Max 500℃
|
| Exhaust |
Exhaust duct can be connected.
|
| Dimensions(W x D x H) |
750 x 1,030 x 360 mm
|