Hot Plate

The hot plate applies heat to the underside of substrate to facilitate uniform drying of coating materials and moisture on the top surface.


  1. Compact device ideal for an experimental laboratory
  2. Elimination of unevenness caused by items such as pins thanks to the flat surface of the hot plate
  3. Optional installation of substrate support pins and lifting mechanism for substrate removal


 Substrate size
Max. W400 x L500 mm
 Processing temp
Max 350℃
Exhaust duct can be connected.
 Dimensions(W x D x H)
750 x 1,030 x 360 mm

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