Wet Prosessing Systems
Tried and true wet processing systems for large TFT arrays
Features
Cleaning Processor TS series
- The inclined substrate transfer system and multiphase cleaning used in the TS series enabled effective particle removal.
- The inclined transfer system reduces consumption of DI water and air.
Wet Etcher TE series
- A combination of original spray nozzles and horizontal/inclined processing enables outstanding etching processes to suit customers' processes.
- Rinsing and drying chambers employs inclined transfer system, which reduces consumption of DI water and air.
Resist Stripper TR series
- The TR series equipment's Multi Scan Jet stripping tool and inclined transfer system enable extremely effective stripping. They inhibit the generation of mist, and prevent resist from re-adhering to or remaining on the substrate.
- The inclined transfer system reduces consumption of DI water and air.
- Inline cleaning modules are available for cleaning after resist stripping.
Developing Processor TD series
- Dip, Spray or puddle processing are available.
- The inclined transfer system reduces consumption of DI water and air.
- Integrated photolithography line configuration (Coater/Developer) is available. (option)
【Substrate size】
300 × 300mm or larger