Wafer Pattern Inspection System
ZI-3600
【Wafer size 100mm ~ 300mm】
Flagship Model Featuring High-resolution Inspection of Wafers up to 300mm
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Wafer size 76mm ~ 200mm
Wafer Pattern Inspection SystemZI-2000
High-speed, Superior cost performance.
Features
- The ZI-2000 can be used in a wide variety of processes from in-process inspections in the frontend wafer process, where flexibility is demanded, to final visual inspections, where speed is of the essence.
- The inspection head employs a proprietary lens/lighting system and a high-speed image processing engine, allowing high throughput that is unaffected by the size or number of chips on the wafer.
- Inspection recipes can be easily created to inspect even new wafers promptly thanks to an inspection method that does not require comparison with the reference image.
- All inspection results can be confirmed in real time. The unit's real-time ADC (Auto Defect Classification) function makes it possible to check just the results required when inspection ends.
| Wafer size | φ3 to φ8 inch (φ76 to φ200 mm) |
|---|---|
| Transfer | Robot transfer system |
| Inspection method | Comparative (Die to Die, Cell to Cell) |
| Light source | RGB 3-color LED lighting (choice of 3 colors) |
| Optical resolution | 1.5μm×1.5μm 4μm×4μm |
| Dimensions (WxDxH) | 1,400mm × 1,250mm × 2,030mm |