Image positional accuracy has been dramatically improved by structural optimization design.
It delivers a sophisticated and high level of performance with stability that will be required to produce the future ICS.
A cooling mechanism has been added to optimize temperature management inside the system. Furthermore, improving the cooling efficiency drive unit and cutting off heat conduction to the main body base, provide improvment in imaging positional accuracy.
The rigidity of the main body frame has been significantly improved compared to conventional models.
In addition, the positional relationship of the exposure head, alignment unit and other hardware have been revamped to create an optimal platform.
Head calibration is performed while the operator exchanging boards, which consistently delivers high accuracy with excellent productivity.
It provides stable imaging quality with various mechanisms that can automatically handled for warpage regardless the type of board.
The Ledia 8 is equipped with a variety of alignment functions to meet the increasing demands for alignment accuracy requirements.
The cross-sectional shape of the photosensitive material can be controlled by adjusting the wavelength mixing ratio.
