Ledia 7
The most ideal direct imaging equipment for various semiconductor package substrates by starting with FC-CSP
Large sizes
We also offer models*in sizes of up to 32 inches that retain the exposure quality of smaller sizes. These variants are also suitable for use in applications that involve metal masks that demand high render precision and large-format materials such as probe circuit boards.
*LI-7F-L
THE FINEST IMAGING QUALITY
●Effectiveness at higher resolution

Curve pattern getting smoother
●Samples


*This is a limited sample exposed under the conditions, whitch specified By SCREEN


*This is a limited sample exposed under the conditions, whitch specified By SCREEN


*This is a limited sample exposed under the conditions, whitch specified By SCREEN


*This is a limited sample exposed under the conditions, whitch specified By SCREEN
Design matching, enabling highly accurate alignment!
●Can be used even if it is not a Point symmetric figure and Any pattern can be used as an alignment mark.


3 WAVELENGTHS LED TECHNOLOGY
●3 wavelength LEDs technology

●3 wavelength LEDs technology

Various alignment method
●Scan alignment

●Alignment algorithm

Auto-focus function
●Auto-focus and measures for panel warpage

●The idea of automation

The idea of automation


●2D code imaging function

●Automation




