he pinnacle of Ledia series

The highest positioning accuracy, excellent drawing quality,outstanding productivity, and all the key features are combined in this one unit to perform any high-end exposure requirement.

Constant Calibration System

Head calibration is performed while the operator exchanges boards, consistently delivering high accuracy with excellent productivity.

The excellent accuracy platform

Brilliant precision is achieved through the high reputation of the Constant Calibration System of the Ledia 8F.

Temperature control

Feature 1

A cooling mechanism has been added to optimize temperature management inside the system.
Furthermore, improving the cooling efficiency of the drive unit and cutting off heat conduction to the main body base, provide improvement in imaging positional accuracy.

Renewed main body platform

Feature 2

The rigidity of the main frame has been significantly improved compared to previous models. Furthermore, the positioning of components such as the exposure head and alignment unit has been optimized to achieve the ideal platform.

ideal resolution characteristic for high-end products

Qs has the ideal resolution characteristic for high-end products by achieving the world's finest accuracy with a multiple wavelength direct image system and contributing to the high-end substrates production as well as the next-generation development products.

FCBGA's film type SR φ35μm t=18μm

SEM image taken directly above the opening
SEM image taken at an angle above the opening
Cross-section diagram

Photo patternable film to form fine-pitch circuits on package substrates

L/S=7/7μm

L/S=7/7μm

SEM image of the circuit taken from a diagonal angle above

L/S=7/7μm

t=25μm

SEM image of the circuit taken from a diagonal angle above

7μm Line

t=25μm

SEM image of the circuit taken from a diagonal angle above

Photo patternable permanent materials for structure fabrication and high aspect ratio patterning.

L/S=40/40μm

t=約100μm

SEM image of the circuit taken from a diagonal angle above

L/S=40/40μm

t=約100μm

SEM image of the circuit taken from a diagonal angle above

20μm line

t=135μm

SEM image of a curved circuit viewed from above at an angle

Achieved the world's highest drawing quality as a broad-wavelength Direct Imaging System. Contributes to the production of high-end substrates and the realization of next-generation development products.

Automation and online-host support (SECS/GEM)

Ledia's Photo
Host Online Concept Diagram

Strengthen integration with production lines to advance smart factory initiatives. Based on the host online concept diagram, achieve real-time control and traceability.