Fan-out Panel Level Packaging (FOPLP) get significant attention as one of the latest packaging trends in microelectronics. Using a panel level format, FOPLP has cost advantages and productivity benefits over conventional packaging methods.
Fan-out Panel Level Packaging (FOPLP) get significant attention as one of the latest packaging trends in microelectronics. Using a panel level format, FOPLP has cost advantages and productivity benefits over conventional packaging methods.