Fan-out Panel Level Packaging (FOPLP) get significant attention as one of the latest packaging trends in microelectronics. Using a panel level format, FOPLP has cost advantages and productivity benefits over conventional packaging methods.
Equipment for FOPLP, an advanced semiconductor packaging
- Single Substrate Coater LC-M550G/750G
- Wet process（Cleaner・Developer・Wet etcher・Resist stripper
*FEBACS site（SCREEN group company)