SCREEN Semiconductor Solutions Co., Ltd.

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Spectroscopic Film Thickness Measurement System


Measurement Equipment to Support Electronic Devices for loT.

  • C-WET spin

Integrated Platform Concept

  • Supports wafer sizes from ø100 to ø300 mm
  • Supports a diverse range of wafer transport mechanisms, such as FOUP, SMIF and open cassette
  • Use of common parts offers stable supply and shorter lead times


1. Optimal for film thickness control on a mass-production line

The VM-3500 uses a light wave interference method to rapidly measure film thickness. This method offers superior performancevs. cost. The VM-3500 also supports optional image recognition functionality to measure specific locations on patterned wafers.

2. Handles a wide range of film thicknesses

The VM-3500 supports both the fitting method and the peak-and-valley method to calculate the film thickness from interference waveforms, up to four layers and over a wide range of thicknesses. Different heads are used to cover a wide range of light, from ultraviolet to near-infrared.

3. Many different film type programs

The VM-3500 offers 25 standard film type programs, and supports the creation of programs for specialized film types and structures with the help of SCREEN's expert engineers.