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Wet Station FC-821L

Wet Station FC-821L


  1. These systems enable half-pitch transfer of wafers. The size of baths has been reduced to minimize the volume of chemicals and DI water used.
  2. The CHB chemical circulation bath allows processing with even high-temperature and highconcentration chemicals. The FC-821L supports a wide range of cleaning processes.
  3. These systems feature one-bath processing to allow both chemical and water cleaning processes in a single bath, and always maintain saturation to internal segments of fi ne patterns, to ensure effi cient cleaning. Native oxide fi lm is also minimized because the wafers never come in contact with the atmosphere during the cleaning process. Because fi ve types of chemicals can be used in a single bath, the system can be fl exibly adapted to accommodate a wide range of cleaning processes.
  4. The FC-821L incorporates a low-pressure dryer that totally eliminates water mark generation.

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