SCREEN Semiconductor Equipment Company

Integrated circuits (IC, LSI) are built into various different kinds of electronic devices, including PCs, cell phones, cars and household appliances. The level of circuit integration and performance for ICs is projected to double every 18 months, and according to the road map laid out for the semiconductor industry, the DRAM half pitch (half the width of 1st metal line) for circuit patterns will progressively shrink from 57 nm (one nanometer is one billionth of a meter) in 2008 to 32 nm in 2013.
The substrate for integrated circuits is a wafer made of highly pure single crystal silicon. Wafers 300 mm in size that yield a greater number of chips per wafer are the most commonly used.