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Wafer Pattern Inspection System ZI-2000
Features
- The ZI-2000 can be used in a wide variety of processes from in-process inspections in the frontend wafer process, where flexibility is demanded, to final visual inspections, where speed is of the essence.
- The inspection head employs a proprietary lens/lighting system and a high-speed image processing engine, allowing high throughput that is unaffected by the size or number of chips on the wafer.
- Create inspection recipes easily and inspect even new wafers promptly thanks to an inspection method that does not require comparison with the master image.
- All inspection results can be confirmed in real time. The unit’s real-time ADC (Auto Defect Classification) function makes it possible to check just the results required when inspection ends.
Features
| Wafer | φ3 to φ8 inch (φ75 to φ200 mm) |
| Transfer | Robot transfer system |
| Inspection method | Comparative (Die to Die, Cell to Cell) |
| Light source | RGB 3-color LED lighting (choice of 3 colors) |
| Optical resolution | 1.5 μm × 1.5 μm |
| Inspection time | φ75mm wafer: 20 sec. φ100mm wafer: 27 sec. φ125mm wafer: 35 sec. φ150mm wafer: 45 sec. φ200mm wafer: 68 sec. |
| Dimensions (WxDxH) | 1,400mm × 1,250mm × 2,030mm |
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