- November 30, 2011
- The Launch of a Single Wafer Cleaning System That Realizes World’s Best Productivity
(160KB) - November 25, 2011
- Dainippon Screen Enters Market for Semiconductor Post-processing Exposure Systems — Launch of Maskless Direct Imaging Exposure System Offering Both Improved Yield and Productivity —
(168KB) - November 29, 2010
- Screen to Enter Market for Semiconductor Wafer Pattern Inspection System
— Will Augment Lineup of Green Device Manufacturing Equipment —
(158KB) - November 24, 2010
- Release of Next-generation Single Wafer Cleaning System
— Simultaneous Achievement of World’s Best Productivity and Clean Level —
(173KB) - October 12, 2010
- Establishment of World’s First Cleaning Technology for Ultra Miniaturization — Achieving Increased Yield in Next-generation Semiconductor Devices through Optimization of Cleaning Droplet Energy
(242KB) - June 24, 2010
- Launch of a Wafer Cleaning System for Green Devices
Full-Scale Entry into the Environmental Technology Market Sector,
Including LEDs and Power Devices
(116KB)
- SEMICON Korea 2012
- Dates: Feb. 7 - 9
Venue: Seoul, Korea - SEMICON China 2012
- Dates: Mar. 20 - 22
Venue: Shanghai, China - Semicon Russia 2012
- Dates: May. 15 - 16
Venue: Moscow, Russia - SEMICON West 2012
- Dates: Jul. 10 - 12
Venue: San Francisco, USA
SSERC Co., Ltd.

Refurbishment of electronics equipment
SEBACS Co., Ltd.

Maintenance for semiconductor manufacturing equipment in Japan
FASSE Co., Ltd.

Assembly, inspection, installation, and setup of semiconductor








