Fast, high-precision inspection of boards with 24 µm and higher line-and-space patterns

FEATURES

1. Supports high precision PCBs
   The newly developed image-processing unit enables the inspection for high-precision line-and-space patterns of PCBs with no deterioration in inspection quality or throughput.
   

   L&S(µm)	24	36	48	72
   Side / hour	149	175	198	236

   Note: Board size = 610 x 457 mm
2. Higher inspection quality
   1) Updated image capture system
   The image capture system has been significantly improved. A new type of illumination that enables imaging of micro-shorts and a CCD board that dramatically improves the S/N ratio enhance the PI-9000's ability to detect even the smallest defects.
   
   2) New inspection algorithms
   Open/short pattern matching inspection has been added to enhance the detection capability for open/short defects. After positioning using our unique "comparison using shaking function" technology, the line connection status is investigated by DRC for highly sensitive detection of open/short defects.
   
   3) Fewer false calls
   A new function has been added to reduce the number of DRC false calls caused by design or production factors. This function prevents designated false calls at specified positions with pinpoint accuracy to reduce overall false calls while maintaining the detection capability.
   
   4) Improved detection of through-holes and special via
   The hole inspection function has been enhanced for PCBs that demand high quality at the hole positions, such as in-vehicle PCBs. Improved hole-recognition resolution and hole-filling accuracy enhances the detection capacity of minute defects at the hole positions. A function helps to reduce false calls of special via, without disabling detection for these particular areas.
3. Improved operability
   1) Automatic setting of inspection parameters
   Automatic setting of board thickness, binary levels, and inspection parameters (DRC & PMI) has been further improved. Inspection parameters with due consideration of the etching factor can be automatically created. This makes setup simpler and quicker than on previous models.
   
   2) Updated GUI
   The GUI windows have been updated. The easy screen to operate windows and image magnification for defect verification make the system easier to use than before.
   
   3) Apron cover slide mechanism
   The apron cover position can be changed according to the PCB size. This reduces the inspection time. It also improves the efficiency of defect verification operations with the built-inVT unit.
   
   4) Package board inspection
   This function enables more efficient inspection and verification of multiple-piece boards such as package boards. When the number of defects in any piece or sheet exceeds a set value, this function decreases the amount of work involved in checking for defects in that area. The result is a significant increase in defect verification efficiency.
   
   5) Four-side/eight-side switching
   Four-side and eight-side data set switching functions have been added to the previous flip inspection function. This allows instantaneous switching of the data set for the inspection of diverse types of PCBs, such as prototypes.