Feature

1. Covers a wide variety of cleaning processes, with the cleaning ability enough for semiconductor manufacturing.
2. The Spin processing system results in highly efficient chemical processing and DI water cleaning.
3. Space saving with its one-chamber system.
4. The use of an air flow control drum prevents mist from reattaching to the glass substrate during spin drying.
   The exhaust rate is also reduced.
5. Inline to the next process equipment such as laser anneal equipment is available.

Substrate size縲€730 × 920 mm