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Spectroscopic Film Thickness Measurement System VM-3500

Spectroscopic Film Thickness Measurement System VM-3500



Integrated
Platform Concept


Integrated Platform Concept


 - Supports wafer sizes from ø100 to ø300 mm

 - Supports a diverse range of wafer transport mechanisms, such as FOUP, SMIF and open cassette

 - Use of common parts offers stable supply and shorter lead times


<Others>
Ellipsometric Film Thickness Measurement System System RE-3500
Wafer Pattern Inspection System ZI-3500


Features

  1. Optimal for film thickness control on a mass-production line
    The VM-3500 uses a light wave interference method to rapidly measure film thickness. This method offers superior performancevs. cost. The VM-3500 also supports optional image recognition functionality to measure specific locations on patterned wafers.
  2. Handles a wide range of film thicknesses
    The VM-3500 supports both the fitting method and the peak-and-valley method to calculate the film thickness from interference waveforms, up to four layers and over a wide range of thicknesses. Different heads are used to cover a wide range of light, from ultraviolet to near-infrared.
  3. Many different film type programs
    The VM-3500 offers 25 standard film type programs, and supports the creation of programs for specialized film types and structures with the help of SCREEN's expert engineers.

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