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SCREEN receives "Excellent Performance Award" from TSMC for Clean & Track Equipment Achievements

December 4, 2015

Doc. No.: SPE151204E

 

Kyoto, Japan - December 3, 2015 - SCREEN Semiconductor Solutions Co., Ltd. ("SCREEN") has been honored with "Excellent Performance in Clean and Track Equipment" at the 15th Annual Supply Chain Management Forum by Taiwan Semiconductor Manufacturing Company, Ltd. ("TSMC"), the world's largest semiconductor manufacturing foundry (Headquarters: Hsinchu, Taiwan; Chairman: Dr. Morris Chang).

  

Award ceremony

Right: Dr. Mark Liu,
President & Co-CEO, Taiwan Semiconductor Manufacturing Co., Ltd.
Left: Tadahiro Suhara,
President, SCREEN Semiconductor Solutions Co., Ltd.


Please download the photo from
http:// www.screen.co.jp/eng/spe/nl-photo/SPE151204E.zip

 

TSMC holds its annual Supply Chain Management forum to show appreciation for the support and contributions of its suppliers; and hundreds of suppliers around the world in the fields of equipment, materials, packaging, testing, facilities, IT systems and services, and environmental and waste management services participate in the forum. This year 2015, SCREEN has been awarded for achievements in single wafer cleaning, AquaSpin SU-3200, and photolithography track, SOKUDO DUO, equipment performance and support. TSMC Dr. Mark Liu President and Co-Chief Executive Officer, presented SCREEN as a winner of the "Excellent Performance Award" during the event ceremony in Taiwan.

 

While presenting the award TSMC highlighted SCREEN's state-of-the-art clean and track equipment introduction in 10nm/7nm node research and development as well as achievements in enabling 20nm-to-16nm node manufacturing technology transition with cost efficient equipment productivity improvements. The SOKUDO DUO lithography photoresist coat/develop track platform was first released in 2009 with an innovative dual level track design and has since made continuous technology enhancements to provide leading-edge capability for immersion ArF coating and, more recently, EUV lithography. Likewise, the SU-3200 single wafer cleaner was first introduced by SCREEN in 2010 with proprietary, ultra-clean process chamber technology that has since become the industry standard for achieving advance technology node semiconductor chip yield and continuous equipment productivity
improvements.

 

SCREEN had previously been the first recipient of TSMC's Supply Chain Management forum "Environmental Excellence Award" in the year 2011 resulting from substantial reductions in environmental impact with its SU-3200 single wafer cleaning equipment. SCREEN Semiconductor Solutions, Ltd. aims to continuously contribute to the development of the semiconductor industry by further strengthening its relationships with customers as a leading manufacturer of semiconductor equipment and actively engaging in technology development collaborations around the world.

 

 

About Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
1Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. The company's total managed capacity reached 16.4 million eight-inch equivalent wafers in 2013. www.tsmc.com

 

About SCREEN Semiconductor Solutions, Ltd.
SCREEN Semiconductor Solutions has been established as a group company of SCREEN Holdings. It inherits all of the semiconductor equipment business from its predecessor, Dainippon Screen. On a base of the core technologies in etching and photolithography that has been cultivated over the years, it is a specialized manufacturer of semiconductor production equipment in various areas such as wafer cleaning equipment, lithography equipment and anneals, and is one of the world's top 10 suppliers. For more information, please visit: www.screen.co.jp/eng/spe

Contact:
Business Management Div.
 +81-75-417-2527
speinfo@screen.co.jp

 


   Information contained in the news letter are current on the date of publication, but may be subject to change without notice.


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