Home  > Events and Seminars > 2006 > SEMICON Japan 2006

Print

SEMICON Japan 2006

Exhibit information

Dainippon Screen will display a full range of 300 mm equipment, including the FC3100 wet station, capable of high throughput of 460 wafers per hour; the new SS-3000BC spin scrubber, equipped with Nanospray2, bevel, and other physical cleaning technologies; and the LA-3000-F flash lamp annealing system, pioneer of long-pulse technology.
In addition, during the exhibition period, we will unveil the all-new AQUASPIN single wafer cleaning equipment in a special display area. Do not miss this opportunity to visit the Dainippon Screen booth and see this piece of cutting-edge technology for yourself.

Information

Date: Wed. 6th to Fri. 8th, December 2006 (10 a.m. to 5 p.m.)

Location: Japan Convention Center, Makuhari Messe, Chiba, Japan

Venue: Exhibition hall 4 (4D-601)

Hall scenery
 

Equipment on display

[NEW] New single wafer cleaning equipment
SU-3100
  Single wafer cleaning equipment
SU-3000
[NEW] Scrubber
SS-3000BC
  Wet station
FC-3100
Flash lamp annealing system
LA-3000-F
  Spectroscopic film thickness measurement system
VM-1200
LAMBD ACE
[NEW] Spectroscopic film thickness measurement system
VM-2200
LAMBD ACE
  Ellipsometric film thickness measurement system
RE-3000/3100
LAMBD ACE

 

   
Non-abrasive cleaning delivers low costs and high production
 
Advanced design helps to optimize the cleaning process
 

To top of page