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16th Annual SOKUDO Lithography Breakfast Forum

SOKUDO Lithography Breakfast Forum
"Double Patterning Jumps the 200wph Hurdle"

Date:      Wednesday, July 15, 2009
Location: San Francisco Marriott, Yerba Buena, Salon 9
              Mission & 4th Street, San Francisco, California

Presentation Files
GLOBALFOUNDARIES, Tom Wallow View Presentation (PDF:3.1MB)
Nikon, Stephen Renwick View Presentation (PDF:63KB)
ASML, Skip Miller View Presentation (PDF:4.1MB)
Sokudo, Charles Pieczulewski View Presentation (PDF:1.6MB)
Gartner, Bob Johnson View Presentation (PDF:219KB)

Immersion lithography Double Patterning variations are many but the common challenge is having a cost-effective solution. The photolithography infrastructure prepares to bring double patterning to volume production at high throughput to achieve industry CoO goals.

See also on-line SEMICONDUCTOR INTERNATIONAL article 2009 July 16 "Toolmakers Ease Double Patterning Throughput Hit" by Aaron Hand:
http://www.semiconductor.net/article/315511-Toolmakers_Ease_Double_Patterning_Throughput_Hit.php


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