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May 27, 2013

Doc. No.: NR130527E

Dainippon Screen Launches High-end Automatic Final Visual Inspection System for PCB

Kyoto, Japan - May 27, 2013 - Dainippon Screen Mfg. Co., Ltd. has developed the FP-9000, a high-end automatic final visual inspection system that inspects PCB for visual and functional defects before assembly. This system meets the high inspection requirements for the manufacturing processes of the PCB used in smartphones, tablet PCs and in-vehicle systems and further improves inspection speed and defect detection capabilities. Sales of the FP-9000 are scheduled to begin in October 2013.

 

 

 

 

FP-9000

Please download the photo from:

www.screen.co.jp/eng/press/nr-photo_2012-2013.html

 


Expected start date for sales:

October 2013

Expected annual sales (first year):

50 units


 

 

 

 

In recent years, demand has expanded rapidly for the PCB mounted in smartphones and tablet PCs as they become progressively smaller and more multi-functional. It has also grown for the PCB in hybrid and electric vehicles, which are fitted with a large number of electric parts, as they become more mainstream. In addition, particularly from a safety perspective, there is an urgent need to improve the reliability of inspections for in-vehicle PCB, which are mainly subject to visual inspection. As a result, each PCB manufacturer requires the creation of an inspection system that both improves productivity and is more dependable.

Based on these industry trends, Screen has developed the FP-9000 as a high-end model of its automatic final visual inspection systems for PCB. This system inherits various features of the existing FP-8200, including its high inspection quality and ability to flexibly handle a range of PCB. Thanks to its redesigned transfer mechanism, the FP-9000 also delivers high throughput of up to 15,000 boards per day.* In addition, this model offers a color digital interpolation function capable of displaying high-resolution inspection images with smooth gradients as well as a four channel imaging sensor** that can enhance the contrast of dark areas on PCB. The four channel imaging sensor is included in a PCB inspection system for the first time in the world and together these two functions significantly improve the detection capabilities for defects in detailed and dark areas, which were previously difficult to inspect. The FP-9000 is also able to handle inspection areas from a minimum of 50 x 50 mm up to a maximum of 350 x 450 mm.*** Small size substrates can easily be inspected and automatic inspection is also possible for the increasingly large PCB required for industrial devices.

With the launch of the FP-9000, Screen is targeting the acquisition of a larger share of the market for PCB visual inspectors, which is expected to expand extremely rapidly. Screen also intends to continue creating top-class technology to resolve the problems and answer the needs of individual customers and contribute to the expansion of the overall market.

 

 

    * Based on Screen standard conditions

  ** Imaging sensor with a B/W channel added to the conventional three channels (RGB)

*** PCB size compatible with 30 μm models

 

Note: This system will be exhibited at JPCA Show 2013 (43rd International Electronic Circuits Exhibition), to be held at Tokyo Big Sight in Ariake, Tokyo from June 5 (Wednesday) to 7 (Friday), 2013.

 

 


 Information contained in the news release are current on the date of publication, but may be subject to change without notice.


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