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Low-inductance antenna (LIA) plasma technology and our large substrate transfer technology are used in large substrate processing equipment such as for CVD and sputtering.
LIA plasma technology features high-density plasma generation while reducing damage to substrates, while large substrate transfer technology was developed for our FPD manufacturing equipment that holds the largest share of the world market. These technologies are combined to enable high-speed, uniform processing even with large substrates.
This equipment can be used in wide range of areas such as CVD systems, sputtering systems, and etching.


LIA Plasma CVD Equipment

Features

  • High deposition rate
    SiNx 3.0nm/sec. or higher

  • Excellent uniformity
    ±3% or less
    (ex. Effective area 1,200mm x 1,000 mm)


  • Deposition-up type

LIA Sputter equipment

Features

  • High deposition rate
    SiNx 2.5nm/sec.
    Al2O3 1.5nm/sec.


  • High quality crystal ITO
    Resistivity: 120μΩ・cm or less
    High transmissivity of 90% or higher
    Surface roughness: Ra 1nm or less


  • Excellent uniformity
    ±3% or less
    (ex. Effective area 1,200mm x 1,000 mm)


  • Deposition-up type

Laboratory Equipment

High-precision technology can now be easily introduced in a laboratory setting.

LIA Plasma CVD Equipment for Lab VC-R 400G/F
LIA Sputter Equipment for Lab VS-R 400G/F
LIA Dry Etching Equipment for Lab VE-R 400G

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