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LIA Sputter Equipment  VS-R400G/F

SCREEN's proprietary LIA(Low Inductance Antenna) Plasma source enables ultra high speed, high quality deposition.

Features

  1. Sputter equipment for testing, research, evaluation, and trial production.
  2. Using the assistive effect of LIA-ICP (Inductively Coupled Plasma) for high speed, high accuracy, low damage deposition
  3. An LIA-ICP assist function can be added to reactive sputtering for ultra high-speed deposition (more than 5x faster than SCREEN's conventional units).
  4. A rotary cathode incorporated for pure metal sputtering enables both high-speed deposition and COO reduction.
  5. Verification on this Laboratory Equipment can be easily fed back to production units.

R&D to mass production

  Supports mass-production of various substrate sizes.

Specifications

 Model name
VS-R400G
VS-R400F
 Substrate type
Square substrate
(Glass, Metal, etc.)
Resin film (PET, PEN),
metal foil
 Target for deposition
ITO, ALUMINA, Chemical compaund, and other metal film
 Substrate size*
W400 x L500 mm
500 mm width
 Deposition method
Deposition down, in-line deposition

* Contact us for other substrate sizes.

 

* LIA is a trademark of EMD Corporation.

 

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